科学研究
 

韦小凤 朱学卫(通讯作者)《TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA》,2017

          发布日期:2017-09-14     浏览次数:

     

论文题目:《Growth behavior and microstructure of intermetallics at interface of AuSn20 solder and metalized-Ni layer

论文链接:http://www.sciencedirect.com/science/article/pii/S1003632617601390

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